WTS001_p26-49 6/14/07 10:56 AM Page 45 Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS 621/623 SERIES Footprint Dimensions in. (mm) Height in. (mm) Mounting Hole Pattern 4.750 (120.6) x 1.500 (38.1) 4.750 (120.6) x 1.500 (38.1) 4.750 (120.6) x 3.000 (76.2) 4.750 (120.6) x 3.000 (76.2) 0.461 (11.7) 0.461 (11.7) 0.461 (11.7) 0.461 (11.7) (1) TO-3 None (1) TO-3 None Standard P/N 621A 621K 623A 623K Low-Profile Heat Sinks for All Metal-Case Power Semiconductors A general purpose yet efficient heat dissipator for TO-3 and virtually all other styles of metal case power semiconductor package types, the 621 and 623 Series low-profile flat back heat sinks find a wide variety of applications. The central channel between fins measures 1.300 in. (33.0) (min.) in TO-3 Thermal Performance at Typical Load Natural Forced Convection Convection 75C @ 15W 75C @ 15W 52C @ 15W 52C @ 15W 2.0C/W @ 250 LFM 2.0C/W @ 250 LFM 1.5C/W @ 250 LFM 1.5C/W @ 250 LFM Weight lbs. (grams) 0.1000 (45.36) 0.1000 (45.36) 0.2100 (95.26) 0.210O (95.26) width, accommodating many types of packages. Mounting hole pattern "A" is predrilled for the standard TO-3 package. Material: Aluminum Alloy, Black Anodized. MECHANICAL DIMENSIONS 621 AND 623 SERIES (EXTRUSION PROFILE 1327) NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES K A Dimensions: in. (mm) 301/302/303 SERIES Outline Dimensions in. (mm) Length "A" in. (mm) Mounting Hole (s) Pattern and Number 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 0.750 (19.1) 0.750 (19.1) 0.750 (19.1) 1.500 (38.1) 1.500 (38.1) 1.500 (38.1) 1.500 (38.1) 3.000 (76.2) 3.000 (76.2) 3.000 (76.2) 3.000 (76.2) None (1) 10-32UNF, 0.625 in. thread depth (1) 14 -28UNF, 0.625 in. thread depth (1) 10-32UNF, 0.625 in. thread depth (2) 10-32UNF, 0.625 in. thread depth (1) 14 -28UNF, 0.625 in. thread depth (2) 14 -28UNF, 0.625 in. thread depth (1) 10-32UNF, 0.625 in. thread depth (2) 10-32UNF, 0.625 in. thread depth (1) 14 -28UNF, 0.625 in. thread depth (2) 14 -28UNF, 0.625 in. thread depth Standard P/N 301K 301M 301N 302M 302MM 302N 302NN 303M 303MM 303N 303NN Compact Heat Sinks for Dual Stud-Mounted Semiconductor Cases The large fin area in minimum total volume provided by the radial design of the 301/302/303 Series offers maximum heat transfer efficiency in natural convection. All types are available with one tapped mounting hole for rectifiers and other stud-mounting semiconductors; the Thermal Performance at Typical Load Natural Forced Convection Convection 70C @ 15W 70C @ 15W 70C @ 15W 50C @ 15W 50C @ 15W 5OC @ 15W 50C @ 15W 37C @ 15W 37C @ 15W 37C @ 15W 37C @ 15W 2.5C/W @ 250 LFM 2.5C/W @ 250 LFM 2.5C/W @ 250 LFM 1.8C/W @ 250 LFM 1.8C/W @ 250 LFM 1.8C/W @ 250 LFM 1.8C/W @ 250 LFM 1.3C/W @ 250 LFM 1.3C/W @ 250 LFM 1.3C/W @ 250 LFM 1.3C/W @ 250 LFM STUD-MOUNT Weight lbs. (grams) 0.0580 (26.31) 0.0580 (26.31) 0.0580 (26.31) 0.1330 (60.33) 0.1330 (6033) 0.1330 (60.33) 0.1330 (60.33) 0.2680 (121.56) 0.2680 (121.56) 0.2680 (121.56) 0.2680 (121.56) 302 and 303 Series offer maximum cost savings with dual mounting locations ("MM" and "NN" mounting hole patterns) for two stud-mount devices. Material: Aluminum Alloy, Black Anodized. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES K M N 302 AND 303 SERIES 301 SERIES SERIES 301 302 303 Dimensions: in. (mm) 45 WTS001_p26-49 6/14/07 10:56 AM Page 46 Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS Double-Surface Heat Sinks for TO-3 Case Styles 401 & 403 SERIES Standard P/N 401A 401F 401K 403A 403F 403K Width in. (mm) Overall Dimensions in. (mm) Height in. (mm) Semiconductor Mounting Hole Pattem 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 1.500 (38.1) 1.500 (38.1) 1.500 (38.1) 3.000 (76.2) 3.000 (76.2) 3.000 (76.2) 1.250 (31.8) 1.250 (31.8) 1.250 (31.8) 1.250 (31.8) 1.250 (31.8) 1.250 (31.8) (1) TO-3 0.270 in. (6.9)-Dia Hole None (1) TO-3 0.270 in. (6.9)-Dia Hole None With fins oriented vertically in cabinet sidewall applications, 401 and 403 Series heat sinks are recommended for critical space applications where maximum heat dissipation is required for high-power TO-3 case styles. Forced convection performance is also exemplary with these double surface fin types. Semiconductor mounting hole style "F" offers a single centered 0.270 TO-3; Stud-Mount Thermal Performance at Typical Load Natural Convection Forced Convection 80C @ 30W 80C @ 30W 80C @ 30W 55C @ 30W 55C @ 30W 55C @ 30W 1.5C/W @ 250 LFM 1.5C/W @ 250 LFM 1.5C/W @ 250 LFM 0.9C/W @ 250 LFM 0.9C/W @ 250 LFM 0.9C/W @ 250 LFM Weight lbs. (grams) 0.1500 (68.04) 0.1500 (68.04) 0.1500 (68.04) 0.3500 (158.76) 0.3500 (158.76 0.3500 (158.76) in. (6.9)-diameter mounting hole (with a 0.750 in. (19.1)-diameter area free of anodize) for mounting stud-type diodes and rectifiers. Hole pattem "V" available upon request. Material: Aluminum Alloy, Black Anodized. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 401 SERIES 403 SERIES Dimensions: in. (mm) SEMICONDUCTOR MOUNTING HOLES A V K F 401 AND 403 SERIES (EXTRUSION PROFILE 1024) 413/421/423 SERIES Standard P/N 413A 413F 413K 421A 421F 421K 423A 423K Low-Height Double-Surface Heat Sinks for TO-3 Case Styles and Diodes Width in. (mm) Nominal Dimensions Length in. (mm) Height "A" in. (mm) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 3.000 (76.2) 3.000 (76.2) 3.000 (76.2) 3.000 (76.2) 3.000 (76.2) 3.000 (76.2) 5.500 (140.2) 5.500 (140.2) 1.875 (47.6) 1.875 (47.6) 1.875 (47.6) 2.625 (66.7) 2.625 (66.7) 2.625 (66.7) 2.625 (66.7) 2.625 (66.7) TO-3; DO-5; Stud-Mount Semiconductor Thermal Performance at Typical Load Mounting Hole Pattern Natural Convection Forced Convection (1) TO-3 0.270 in. (6.9)-Dia Hole None (1) TO-3 0.270 in. (6.9)-Dia Hole None (1) TO-3 None Space-saving double surface 413, 421, and 423 Series utilize finned surface area on both sides of the power semiconductor mounting surface to provide maximum heat dissipation in a compact profile. Ready to install on popular power components in natural and forced convection applications. Apply Wake- 72C @ 50W 72C @ 50W 72C @ 50W 58C @ 50W 58C @ 50W 58C @ 50W 47C @ 50W 47C @ 50W 0.85C/W @ 250 LFM 0.85C/W @ 250 LFM 0.85C/W @ 250 LFM 0.7C/W @ 250 LFM 0.7C/W @ 250 LFM 0.7C/W @ 250 LFM 0.5C/W @ 250 LFM 0.5C/W @ 250 LFM Weight lbs. (grams) 0.6300 (285.77) 0.6300 (285.77) 0.6300 (285.77) 0.6300 (285.77) 0.6300 (285.77) 0.6300 (285.77) 1.1700 (530.71) 1.1700 (530.71) field Type 126 silicone-free thermal compound or Wakefield DeltaPadTM interface materials for maximum performance. Material: Aluminum Alloy, Black Anodized. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 423 SERIES (EXTRUSION PROFILE 1025) 413 SERIES (EXTRUSION PROFILE 2276) 421 SERIES (EXTRUSION PROFILE 1025) SERIES 413 421 Dimensions: in. (mm) 46 SEMICONDUCTOR MOUNTING HOLES A F K V WTS001_p26-49 6/14/07 10:56 AM Page 47 Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS 431 & 433 SERIES High-Performance Heat Sinks for 30-100W Metal Power Semiconductors Nominal Dimensions Standard Width Length "A" Height Semiconductor Thermal Performance at Typical Load P/N in. (mm) in. (mm) in. (mm) Mounting Hole Pattern Natural Convection Forced Convection 431K 4.750 (120.7) 3.000 (76.2) 3.000 (76.2) None 55C @ 5OW 0.40C/W @ 250 LFM 433K 4.750 (120.7) 5.500 (139.7) 3.000 (76.2) None 42C @ 5OW 0.28C/W @ 250 LFM Need maximum heat dissipation from a TO-3 rectifier heat sink in minimum space? The Wakefield 431 and 433 Series center channel double-surface heat sinks offer the highest performance-to-weight ratio for minimum volume occupied for TO-3, diode, and stud-mount metal power semiconductors in the 30- to TO-3; Stud-Mount Weight lbs. (grams) 0.7800 (353.81) 1.4900 (675.86) 100-watt operating range. Additional interface resistance reduction for maximized overall performance can be achieved with proper application of Wakefield Type 126 silicone-free thermal compound. Material: Aluminum Alloy, Black Anodized. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS SERIES 431 433 SEMICONDUCTOR MOUNTING HOLE K 431 AND 433 SERIES (EXTRUSION PROFILE 2726) Dimensions: in. (mm) 435 SERIES Standard P/N 435AAAA Lightweight Quadruple Mount Heat Sink for TO-3 Case Styles Nominal Dimensions Width Length Height in. (mm) in. (mm) in. (mm) 4.250 (108.0) 5.500 (139.7) 4.300 (109.2) This lightweight high-performance heat sink is designed to mount and cool efficiently one to four TO-3 style metal case power semiconductors. The Type 435AAAA is the standard configuration available from stock, predrilled for mounting four TO-3 style devices. Increased performance can be achieved with the proper TO-3 Semiconductor Thermal Performance at Typical Load Weight Mounting Hole Pattern Natural Convection Forced Convection lbs. (grams) (4) TO-3 37C @ 50W 0.38C/W @ 250 LFM 1.1500 (521.64) 54C @ 80W 0.24C/W @ 600 LFM selection and installation of a Wakefield Type 175 DeltaPad KaptonTM interface material for each power semiconductor or, for maximum reduction of case-to-sink interface loss, the application of Wakefield Type 126 silicone-free thermal compound. Material: Aluminum Alloy, Black Anodized. MECHANICAL DIMENSIONS Dimensions: in. (mm) NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES AAAA 435 SERIES (EXTRUSION PROFILE 4226) 441 SERIES Standard P/N 441K High-Performance Natural Convection Heat Sinks for Rectifiers and Diodes Nominal Dimensions Width Length Height in. (mm) in. (mm) in. (mm) 4.750 (120.7) 5.500 (139.7) 4.500 (114.3) Designed for vertical mounting within a power supply enclosure or equipment cabinet without forced airflow available. This Wakefield 441 Series heat sink will dissipate up to 100 watts efficiently in natural convection with a maximum 55C heat sink temperature rise above ambient. When applied in a forced convecDimensions: in. (mm) Semiconductor Mounting Hole Pattern None Thermal Performance at Typical Load Natural Convection Forced Convection 34C @ SOW 0.30C/W @ 250 LFM 47C @ 80W 0.19C/W @ 600 LFM Stud-Mount Weight lbs. (grams) 1.9700 (893.59) tion environment, the 441K Type will achieve thermal resistance of 0.18C/W (sink to ambient) at 1000 LFM. Supplied with no predrilled device mounting hole pattern. Material: Aluminum Alloy, Black Anodized. MECHANICAL DIMENSIONS SEMICONDUCTOR MOUNTING HOLE NATURAL AND FORCED CONVECTION CHARACTERISTICS K 441 SERIES (EXTRUSION PROFILE 1273) 47 WTS001_p26-49 6/14/07 10:56 AM Page 48 Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS High-Power Heat Sinks for Medium Hex-Type Rectifiers and Diodes 465 & 476 SERIES Standard P/N 465K 476K 476W Width in. (mm) Nominal Dimensions Length in. (mm) Height in. (mm) Hex Style Type Mounting Hole Pattern 4.000 (101.6) 5.000 (127.0) 5.000 (127.0) 5.000 (127.0) 6.000 (152.4) 6.000 (152.4) 4.000 (101.6) 5.000 (127.0) 5.000 (127.0) 1.060 in. Hex 1.250 in. Hex 1.250 in. Hex None None 0.765 in. (19.4) Dia. Center Mount Wakefield Engineering has designed four standard heat sink types for ease of installation and efficient heat dissipation for industry standard hex-type rectifiers and similar stud-mount power devices: 465, 476, 486, and 489 Series. The 465 and 476 Series shown here are de- Stud-Mount Thermal Performance at Typical Load Natural Convection Forced Convection 38C @ 5OW 25C @ 5OW 25C @ 5OW 0.27C/W @ 500 LFM 0.19C/W @ 500 LFM 0.19C/W @ 500 LFM Weight lbs. (grams) 1.9300 (875.45) 2.8200 (1279.15) 2.8000 (1270.08) signed for 1.060 in. Hex (465 Type) and 1.250 in. Hex (476 Type). The 476W Type is available predrilled for an 0.765 in. (19.4) dia, mounting hole, Material: Aluminum Alloy, Black anodized. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 465 SERIES (EXTRUSION PROFILE 1244) 476 SERIES (EXTRUSION PROFILE 1245) W K SEMICONDUCTOR MOUNTING HOLES Dimensions: in. (mm) 486 & 489 SERIES Heat Sinks for High-Power Hex-Type Rectifiers and Diodes Width in. (mm) Nominal Dimensions Length in. (mm) Height in. (mm) Hex Style Type Mounting Hole Pattern 486K 6.250 (158.8) 6.000 (152.4) 6.250 (158.8) 1.750 in. Hex None 489K 6.250 (158.8) 9.000 (228.6) 6.250 (158.8) 1.750 in. Hex None Standard P/N These two heat sink types accept industry standard 1.750 in. (44.5) hex-type devices for mounting and efficient heat dissipation. Each type is provided with a 1.750 in. (44.5) x 2.000 MECHANICAL DIMENSIONS Stud-Mount Thermal Performance at Typical Load Natural Convection Forced Convection 24C @ 50W 86C @ 250W 19C @ 50W 75C @ 250W 0.20C/W @ 250 LFM 0.13C/W @ 500 LFM 0.15C/W @ 250 LFM 0.10C/W @ 500 LFM Dimensions: in. (mm) 48 486 489 4.2100 (1909.66) 6.1400 (2785.10) in. (50.8) area on the semiconductor base mounting surface which is free of anodize. Material: Aluminum Alloy, Black Anodized. SEMICONDUCTOR MOUNTING HOLE K NATURAL AND FORCED CONVECTION CHARACTERISTICS SERIES Weight lbs. (grams) 486 AND 489 SERIES (EXTRUSION PROFILE 1541) WTS001_p26-49 6/14/07 10:56 AM Page 49 Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS 490 SERIES King Size Heat Sinks for High-Power Rectifiers Standard P/N Width in. (mm) Nominal Dimensions Length "A" in. (mm) Height in. (mm) Semiconductor Mounting Hole Pattern 490-35K 490-6K 490-12K 9.250 (235.0) 9.250 (235.0) 9.250 (235.0) 3.500 (88.9) 6.000 (152.4) 12.000 (304.8) 6.750 (171.5) 6.750 (171.5) 6.750 (171.5) None None None The 490 Series can be used to mount a single high-power rectifier or a grouping of smaller power devices. The semiconductor device mounting surface is free of anodize on the entire surface on one side only; finish overall is black anodize. Use Type 109 mounting brackets (see accessories section) for mounting to enclosure wall and for electrical isolation. The anodize- GENERAL PURPOSE Thermal Performance at Typical Load Natural Convection Forced Convection 84C @ 20OW 60C @ 20OW 45C @ 20OW 0.18C/W @ 600 LFM 0.13C/W @ 600 LFM 0.09C/W @ 600 LFM Weight lbs. (grams) 3.2400 (1469.66) 5.4700 (2481.19) 10.6200 (4817.23) free mounting surface is milled for maximum contact area. The 490 Series Can also be drilled for mounting and cooling IGBTs and other isolated power modules. Material: Aluminum Alloy, Black Anodized. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLE 490 SERIES (EXTRUSION PROFILE 2131) Dimensions: in. (mm) PERFORMANCE, LOW PROFILE HEAT SINKS FOR POWER MODULES & IGBT'S 394, 395, 396 SERIES Standard P/N Overall Dimensions: in. (mm) Length Height in. (mm) in. (mm) Width in. (mm) Device Base Mounting Area (mm) 394-1AB 3.000 (76.2) 1.500 (38.1) 5.000 (127.0) 101 x 76 394-2AB 5.500 (139.7) 1.500 (38.1) 5.000 (127.0) 101 x 139 395-1AB 3.000 (76.2) 2.500 (63.5) 5.000 (127.0) 50 x 76 395-2AB 5.500 (139.7) 2.500 (63.5) 5.000 (127.0) 50 x 139 396-1AB 3.000 (76.2) 1.380 (35.1) 5.000 (127.0) 50 x 76 396-2AB 5.500 (139.7) 1.380 (35.1) 5.000 (127.0) 50 x 139 Note: 1.Thermal resistance values shown are for black anodized finish at 50C rise above ambient. MECHANICAL DIMENSIONS Base Mounting Holes 4 6 4 6 4 6 Thermal Resistance at Typical Load Natural Forced Convection (Osa)(1) Convection (Osa) (C/W) (C/W @ 500 LFM) 1.85 1.51 1.10 0.90 1.85 1.51 0.90 0.60 0.50 0.32 1.07 0.64 NATURAL AND FORCED CONVECTION CHARACTERISTICS 394 SERIES (EXTRUSION PROFILE 7332) NATURAL AND FORCED CONVECTION CHARACTERISTICS 395 SERIES (EXTRUSION PROFILE 7330) NATURAL AND FORCED CONVECTION CHARACTERISTICS 396 SERIES (EXTRUSION PROFILE 7331) Dimensions: in. (mm) 49 WTS001_p50-68 6/14/07 10:46 AM Page 50 Extruded Heat Sinks EXTRUDED HEAT SINKS FOR DC/DC CONVERTERS SERIES 557, 558 & 559 Standard P/N Heat Sinks for "Full-Brick" DC/DC Converters Footprint Dimensions in. (mm) 557-140AB 4.60 (116.8) x 2.40 (61.0) 558-75AB 2.40 (61.0) x 4.60 (116.8) 559-50AB 2.40 (61.0) x 4.60 (116.8) Material: Aluminum, Black Anodized Height in. (mm) Fin Orientation Number of Fins Forced Convection Thermal Resistance at 300 ft/min (C/W) 1.40 (35.6) 0.75 (19.1) 0.50 (12.7) Horizontal Vertical Vertical 6 16 27 1.3 1.8 2.2 14 12 10 * Standard mounting hole pattern mates with Vicor DC/DC converters. * Aluminum extruded fin construction keeps DC/DC converter modules cool in both forced and natural convection applications. * Three fin heights, two flow direction options. * Black anodized finish standard. MECHANICAL DIMENSIONS PRODUCT DESIGNATION * Integral thermal interface pad option eliminates need to order and install pad separately. * Ordering a single part number with the hardware kit option provides everything necessary to keep your converter cool. 557 SERIES DIMENSIONS Dimensions: in. (mm) MECHANICAL DIMENSIONS PRODUCT DESIGNATION 558 SERIES DIMENSIONS Dimensions: in. (mm) MECHANICAL DIMENSIONS PRODUCT DESIGNATION Dimensions: in. (mm) 50 TO-220 and TO-218 Natural Convection Power Dissipation (Watts) 40C Rise Heat Sink to Ambient 559 SERIES DIMENSIONS WTS001_p50-68 6/14/07 10:46 AM Page 51 Extruded Heat Sinks EXTRUDED HEAT SINKS FOR DC/DC CONVERTERS Heat Sinks for "Half-Brick" DC/DC Converters SERIES 517, 527, 518 & 528 Standard P/N Footprint Dimensions in. (mm) 517-95AB 2.28 (57.9) x 2.40 (61.0) 527-45AB 2.28 (57.9) x 2.40 (61.0) 527-24AB 2.28 (57.9) x 2.40 (61.0) 518-95AB 2.40 (61.0) x 2.28 (57.9) 528-45AB 2.40 (61.0) x 2.28 (57.9) 528-24AB 2.40 (61.0) x 2.28 (57.9) Material: Aluminum, Black Anodized Height in. (mm) Fin Orientation Number of Fins 0.95 (24.1) 0.45 (11.4) 0.24 (6.1) 0.95 (24.1) 0.45 (11.4) 0.24 (6.1) Horizontal Horizontal Horizontal Vertical Vertical Vertical 8 11 11 8 11 11 * Standard mounting hole patterns mate with the majority of "half-brick" DC/DC converters on the market. * Aluminum extruded fin construction keeps DC/DC converter modules cool in both forced and natural convection applications. * Vertical and horizontal fin configurations TO-220 and TO-218 THERMAL PERFORMANCE Natural Convection Forced Convection Power Dissipation (Watts) Thermal Resistance 60C Rise Heat Sink to Ambient at 300 ft/min (C/W) 11W 7W 5W 11W 7W 5W 2.1 2.3 4.2 2.2 2.1 3.5 available in a variety of heights. * Black anodized finish standard. * Integral thermal interface pad option eliminates need to order and install pad separately. * Ordering a single part number with the hardware kit option provides everything necessary to keep your converter cool. MECHANICAL DIMENSIONS 517, 527, 518 AND 528 SERIES 517 /527 SERIES DIMENSIONS 518 /528 SERIES DIMENSIONS PRODUCT DESIGNATION Dimensions: in. (mm) MOUNTING HARDWARE FOR EXTRUDED HEAT SINKS 100 SERIES Teflon Mounting Insulators Standard P/N Description 103 107 Spool-shaped insulator Spool-shaped insulator 103 SERIES For Use with Series 300, 400, 600, 111, 113 300, 400, 600, 111, 113 Mounting Hardware #6-32 screw #6-32 screw, nut Material Hipot Rating (VAC) Weight lbs. (grams) Teflon Teflon 1500 5000 0.00012 (0.05) 0.0034 (1.54) 107 SERIES 51 WTS001_p50-68 6/14/07 10:46 AM Page 52 Extruded Heat Sinks EXTRUDED HEAT SINKS FOR DC/DC CONVERTERS Heat Sinks for "Quarter-Brick" DC/DC Converters 537 & 547 SERIES Standard P/N Footprint Dimensions in. (mm) 537-95AB 2.28 (57.9) x 1.45 (36.8) 537-45AB 2.28 (57.9) x 1.45 (36.8) 537-24AB 2.28 (57.9) x 1.45 (36.8) 547-95AB 1.45 (36.8) x 2.28 (57.9) 547-45AB 1.45 (36.8) x 2.28 (57.9) 547-24AB 1.45 (36.8) x 2.28 (57.9) Material: Aluminum, Black Anodized Height in. (mm) Fin Orientation Number of Fins Forced Convection Thermal Resistance at 300 ft/min (C/W) 0.95 (24.1) 0.45 (11.4) 0.24 (6.1) 0.95 (24.1) 0.45 (11.4) 0.24 (6.1) Horizontal Horizontal Horizontal Vertical Vertical Vertical 8 13 14 11 20 22 2.1 2.3 4.2 2.2 2.1 3.5 * Mounting slots accomodate two hole patterns: 1.86" x 1.03" and 2.00" x 1.20", fitting the vast majority of quarter-brick converters on the market. * Designed for optimum use in forced convection applications. * Vertical and horizontal fin configurations available in a variety of MECHANICAL DIMENSIONS TO-220 and TO-218 heights. * Black anodized finish standard. * Integral thermal interface pad option eliminates need to order and install pad separately. * Ordering a single part number with the hardware kit option provides everything necessary to keep your converter cool. 537 & 547 SERIES 537 SERIES DIMENSIONS 547 SERIES DIMENSIONS PRODUCT DESIGNATION Dimensions: in. (mm) 52 WTS001_p50-68 6/14/07 10:46 AM Page 53 Bonded Fin Heat Sinks HIGH FIN DENSITY HEAT SINKS FOR POWER MODULES, IGBTS, RELAYS 510, 511 & 512 SERIES Height Standard Catalog P/N(5) Milled Nonmilled Base(1) Base(2) 510-3M 510-6M 510-9M 510-12M 510-14M 511-3M 511-6M 511-9M 511-12M 512-3M 512-6M 512-9M 512-12M Base Width in. (mm) 510-3U 510-6U 510-9U 510-12U 510-14U 511-3U 511-6U 511-9U 511-12U 512-3U 512-6U 512-9U 512-12U 7.380 (187.452) 7.380 (187.452) 7.380 (187.452) 7.380 (187.452) 7.380 (187.452) 5.210 (132.33) 5.210 (132.33) 5.210 (132.33) 5.210 (132.33) 7.200 (182.88) 7.200 (182.88) 7.200 (182.88) 7.200 (182.88) Notes: 1. Precision-milled base for maximum heat transfer performance (flatness 0.002 in./in.) Length in. (mm) 3.000 (76.2) 6.000 (152.4) 9.000 (228.6) 12.000 (304.8) 14.000 (355.6) 3.000 (76.2) 6.000 (152.4) 9.000 (228.6) 12.000 (304.8) 3.000 (76.2) 6.000 (152.4) 9.000 (228.6) 12.000 (304.8) 0.56 0.38 0.29 0.24 0.21 0.90 0.65 0.56 0.45 0.90 0.65 0.56 0.45 0.088 0.070 0.066 0.062 0.059 0.120 0.068 0.060 0.045 0.120 0.068 0.060 0.045 4. Forced convection heat dissipation for distributed heat sources at 100 cubic feet per minute, shrouded condition. 5. Standard models are provided without finish. 510 Series (Extrusion Profile 5113) A B Flatness 510-U 0.216 (5.5) 3.136 (79.7) 0.006 in./in. (0.15 mm/mm) 510-M 0.165 (4.2) 3.106 (78.9) 0.002 in./in. (0.05 mm/mm) 511 AND 512 SERIES 511 Series (Extrusion Profile 6438-1) 512 Series (Extrusion Profile 6438-2) A B 0.250 (6.4) 2.410 (61.2) 0.372 (9.4) 0.006 in./in. (0.15 mm/mm) 511-M 512-M 0.220 (5.6) 2.350 (59.7 0.342 (8.7) 0.002 in./in. (0.05 mm/mm) 511-U 512-U 3.136 (79.7) 3.136 (79.7) 3.136 (79.7) 3.136 (79.7) 3.136 (79.7) 2.410 (61.2) 2.410 (61.2) 2.410 (61.2) 2.410 (61.2) 2.410 (61.2) 2.410 (61.2) 2.410 (61.2) 2.410 (61.2) NATURAL AND FORCED CONVECTION CHARACTERISTICS Series Series 3.106 (78.9) 3.106 (78.9) 3.106 (78.9) 3.106 (78.9) 3.106 (78.9) 2.350 (59.7) 2,350 (59.7) 2.350 (59.7) 2.350 (59.7) 2.350 (59.7) 2.350 (59.7) 2.350 (59.7) 2.350 (59.7) 2. Nonmilled base flatness: 0.006 in./in. 3. Natural convection heat dissipation for distributed heat sources at 50C rise. MECHANICAL DIMENSIONS 510 SERIES Milled Base (1) ("M Series") in. (mm) Thermal Resistance (5) (Osa) at Typical Load Nonmilled Base (2) Natural Forced ("U" Series) Convection(3) Convection(4) in. (mm) (C/W) (C/W @ 100 CFM) C Flatness Dimensions: in. (mm) 392 SERIES High Performance Heat Sinks for Power Modules, IGBTs and Solid State Relays Standard P/N, Finish Black Gold Anodized Iridite 392-120AB 392-120AG 392-180AB 392-180AG 392-300AB 392-300AG MECHANICAL DIMENSIONS Length in. (mm) 4.725 (120.0) 7.087 (180.0) 11.811 (300.0) Thermal Resistance at Typical Load Natural Forced Convection (Osa) Convection (Osa) (CW) (CW) 0.50 0.16 @ 100 CFM 0.43 0.11 @ 100 CFM 0.33 0.08 @ 100 CFM Weight lbs. (grams) 4.452 (2019.43) 6.636 (3010.09) 1O.420 (4726.51) NATURAL AND FORCED CONVECTION CHARACTERISTICS NATURAL CONVECTION 392-120 (1 MOD) 392-180 (1 MOD) 392-300 (1 MOD) 392-300 (3 MOD) 392 SERIES (EXTRUSION PROFILE 5658) FORCED CONVECTION 392-120 (1 MOD) 392-120 (3 MOD) 392-180 (1 MOD) 392-180 (3 MOD) 392-300 (3 MOD) Dimensions: in. (mm) 53